02 / WAFERS
Polycrystalline CVD Diamond Wafers for Thermal Management and Engineering Applications
Supplier-listed diameter range 5–100 mm and thickness 0.2–2.0 mm (customizable). Supplier-stated thermal conductivity: 1,200–1,800 W/m·K. Choose an as-grown surface or double-side grinding.
Specifications
| Material | Polycrystalline CVD diamond |
|---|---|
| Diameter | 5–100 mm |
| Thickness | 0.2–2.0 mm; customizable |
| Thermal conductivity | 1,200–1,800 W/m·K |
| Surface options | As-grown surface or double-side ground |
Listed dimensions and performance values reflect current supplier information and should be confirmed for the selected batch.
Not sure which specification fits your application? Technical Support ↗
Applications
For thermal management and other engineering applications. Batch-specific performance and availability are confirmed per inquiry.